Category Attribute Current
2009
Near Term
2009-2010
Long Term
2011
Fine Line/Space Inner Layers (Line/Space)3/3 mil2.5/2.5 mil2/2 mil
Outer Layers (Line/Space)3/4 mil3/3 mil2.5/2.5 mil
Buried Core Holes Mechanical (Drilled Hole/Land)5.9/12 mil4/10 mil2.5/2.5 mil
Laser Drill (Drilled Hole/Land)N/A4/13 mil3.5/8 mil
Special Processing Controlled Depth Drilling - Blind ViasYesYesYes
Sequential Lamination - Buried ViasYesYesYes
Via in Pad Technology - Silver EpoxyYesYesYes
Via in Pad Technology - Non Conductive EpoxyYesYesYes
Edge PlatingYesYesYes
Materials High TD - RoHSYesYesYes
Halogen FreeYesYesYes
High PerformanceDk-3.0 Df<0.005Dk<3.0 Df<0.005Dk<3.0 Df<0.002
Polyimide - High TempYesYesYes
TeflonYesYesYes
High Speed RF SignalsYesYesYes
Through Via Holes Drilled Hole/Land5.9/12 mil4/10 mil3.5/8 mil
Registration to Internal Land+/-5.0 mil+/-4.5 mil+/-4.0 mil
Maximum Copper Plating Aspect Ratio15:1.018:1.020:1.0
Panel / Board Maximum Layer Count50 layer60 layer60+ layer
Maximum Thickness0.420.620.09
Maximum Process Panel Size24" x 30"24" x 30"24" x 30"
Impedance Single ended & Differential Pair Tolerance+/- 5%+/- 4%+/- 3%
Imbedded Passives ResistorsN/A+/- 15%+/- 10%
Capacitance/Capacitors2.0 mil Core1.0 mil CoreThin Film
Surface Finish SMOBCYesYesYes
HASLYesYesYes
Lead Free HASLYesYesYes
Electrolytic Hard GoldYesYesYes
Electrolytic Soft GoldYesYesYes
PalladiumYesYesYes
NickelYesYesYes
Carbon InkYesYesYes
Electroless Ni/AuYesYesYes
Immersion SilverYesYesYes
Immersion TinYesYesYes
Organic Surface Protection (Entek)YesYesYes
Quality Standards ISO 9001/2000YesYesYes
IPC 6012 Class 1,2,3YesYesYes
TL 9000NoYesYes
Mil-PRF-31032NoNoYes

Sunrise Electronics West Roadmap Maintained by:


Vickie Duarte
Sr. Product Engineer
vickie@sunrisepcbwest.com
(510) 842-1220